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  to learn more about on semiconductor, please visit our website at www.onsemi.com please note: as part of the fairchild semiconductor integration, some of the fairchild orderable part numbers will need to change in order to meet on semiconductors system requirements. since the on semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the fairchild part numbers will be changed to a dash (-). this document may contain device numbers with an underscore (_). please check the on semiconductor website to verify the updated device numbers. the most current and up-to-date ordering information can be found at www.onsemi.com . please email any questions regarding the system integration to fairchild_questions@onsemi.com . is now part of on semiconductor and the on semiconductor logo are trademarks of semico nductor components industries, llc dba on semiconductor or its subsid iaries in the united states and/or other countries. on semiconductor ow ns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellec tual property. a listing of on semiconductor?s product/patent cover age may be accessed at www.onsemi.com/site/pdf/patent-marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semicon ductor makes no warranty, representation or guarantee regarding the s uitability of its products for any particular purpose, nor does on semico nductor assume any liability arising out of the application or use of any product or circuit, and speci?ca lly disclaims any and all liability, including without limitation spe cial, consequential or incidental damages. buyer is responsible for i ts products and applications using on semiconductor products, including compliance with all laws, regul ations and safety requirements or standards, regardless of any suppor t or applications information provided by on semiconductor. ?typica l? parameters which may be provided in on semiconductor data sheets and/or speci?cations can and do vary in diffe rent applications and actual performance may vary over time. all operat ing parameters, including ?typicals? must be validated for each custo mer application by customer?s technical experts. on semiconductor does not convey any license und er its patent rights nor the rights of others. on semiconductor products a re not designed, intended, or authorized for use as a critical compone nt in life support systems or any fda class 3 medical devices or medical devices with a same or similar classi?ca tion in a foreign jurisdiction or any devices intended for implantation i n the human body. should buyer purchase or use on semiconductor products fo r any such unintended or unauthorized application, buyer shall indemnify and hold on semico nductor and its of?cers, employees, subsidiaries, af?liates, and di stributors harmless against all claims, costs, damages, and expense s, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associa ted with such unintended or unauthorized use, even if such claim alleges th at on semiconductor was negligent regarding the design or manufacture o f the part. on semiconductor is an equal opportunity/af?rmative action employer. this literatu re is subject to all applicable copyright laws and is not for resale in any manne r.
? 2001 fairchild semiconductor corporation ds500506 www.fairchildsemi.com april 2001 revised september 2001 fin1019 3.3v lvds high speed differential driver/receiver fin1019 3.3v lvds high speed differential driver/receiver general description this driver and receiver pair are designed for high speed interconnects utilizing low voltage differential signaling (lvds) technology. the driver translates lvttl signals to lvds levels with a typical differential output swing of 350mv and the receiver translates lvds signals, with a typical differential input threshold of 100mv, into lvttl levels. lvds technology provides low emi at ultra low power dissipation even at high frequencies. this device is ideal for high speed clock or data transfer. features greater than 400mbs data rate 3.3v power supply operation 0.5ns maximum differential pulse skew 2.5ns maximum propagation delay low power dissipation power-off protection 100mv receiver input sensitivity fail safe protection open-circuit, shorted and terminated conditions meets or exceeds the tia/eia-644 lvds standard flow-through pinout simplifies pcb layout 14-lead soic and tssop packages save space ordering code: devices also available in tape and reel. specify by appending the suffix letter x to the ordering code. function table h = high logic level l = low logic level x = dont care z = high impedance fail safe = open, shorted, terminated connection diagram pin descriptions order number package number package description FIN1019M m14a 14-lead small outline integrated circuit (soic), jedec ms-012, 0.150" narrow FIN1019Mtc mtc14 14-lead thin shrink small outline package (tssop), jedec mo-153, 4.4mm wi de inputs outputs r in + r in ? re r out lhl l hll h xxh z fail safe condition l h d in de d out + d out ? lhl h hhh l xlz z open ? circuit or z h l h pin name description d in lvttl data input d out + non-inverting lvds output d out ? inverting lvds output de driver enable (lvttl, active high) r in + non-inverting lvds input r in ? inverting lvds input r out lvttl receiver output re receiver enable (lvttl, active low) v cc power supply gnd ground nc no connect
www.fairchildsemi.com 2 fin1019 absolute maximum ratings (note 1) recommended operating conditions note 1: the absolute maximum ratings : are those values beyond which damage to the device may occur. the databook specifications should be met, without exception, to ensure that the system design is reliable over its power supply, temperature and output/input loading variables. fairchild does not recommend operation of circuits outside databook specification. dc electrical characteristics over supply voltage and operating temperature ranges, unless otherwise specified supply voltage (v cc ) ? 0.5v to + 4.6v lvttl dc input voltage (d in , de, re ) ? 0.5v to + 6v lvds dc input voltage (r in + , r in ? ) ? 0.5v to 4.7v lvttl dc output voltage (r out ) ? 0.5v to + 6v lvds dc output voltage (d out + , d out ? ) ? 0.5v to 4.7v lvds driver short circuit current (i osd ) continuous lvttl dc output current (i o ) 16 ma storage temperature range (t stg ) ? 65 c to + 150 c max junction temperature (t j )1 5 0 c lead temperature (t l ) (soldering, 10 seconds) 260 c esd (human body model) 6500v esd (machine model) 300v supply voltage (v cc ) 3.0v to 3.6v input voltage (v in ) 0 to v cc magnitude of differential voltage (|v id |) 100 mv to v cc common-mode input voltage (v ic ) 0.05v to 2.35v operating temperature (t a ) ? 40 c to + 85 c symbol parameter test conditions min typ max units (note 2) lvds differential driver characteristics v od output differential voltage 250 350 450 mv ? v od v od magnitude change from 25 mv differential low-to-high r l = 100 , see figure 1 v os offset voltage 1.125 1.25 1.375 v ? v os offset magnitude change from 25 mv differential low-to-high i ozd disabled output leakage current v out = v cc or gnd, de = 0v 20 a i off power off output current v cc = 0v, v out = 0v or 3.6v 20 a i os short circuit output current v out = 0v, de = v cc ? 8 ma v od = 0v, de = v cc 8 lvttl driver characteristics v oh output high voltage i oh = ? 100 a, re = 0v, v cc ? 0.2 v see figure 6 and table 1 i oh = ? 8 ma, re = 0v, v id = 400 mv 2.4 v id = 400 mv, v ic = 1.2v, see figure 6 v ol output low voltage i ol = 100 a, re = 0v, v id = ? 400 mv 0.2 v see figure 6 and table 1 i ol = ? 8 ma, re = 0v, v id = ? 400 mv 0.5 v id = ? 400 mv, v ic = 1.2v, see figure 6 i oz disabled output leakage current v out = v cc or gnd, re = v cc 20 a lvds receiver characteristics v th differential input threshold high see figure 6 and table 1 100 mv v tl differential input threshold low see figure 6 and table 1 ? 100 mv i in input current v in = 0v or v cc 20 a i i(off) power-off input current v cc = 0v, v in = 0v or 3.6v 20 a lvttl driver and control signals characteristics v ih input high voltage 2.0 v cc v v il input low voltage gnd 0.8 v i in input current v in = 0v or v cc 20 a i i(off) power-off input current v cc = 0v, v in = 0v or 3.6v 20 a v ik input clamp voltage i ik = ? 18 ma ? 1.5 v
3 www.fairchildsemi.com fin1019 dc electrical characteristics (continued) note 2: all typical values are at t a = 25 c and with v cc = 3.3v. ac electrical characteristics over supply voltage and operating temperature ranges, unless otherwise specified note 3: all typical values are at t a = 25 c and with v cc = 5v. note 4: t sk(pp) is the magnitude of the difference in propagation delay times between any specified t erminals of two devices switching in the same direction (either low-to-high or high-to-low) when both devices operate with the same supply voltage, same temperature, and have identica l test circuits. device characteristics i cc power supply current driver enabled, driver load: r l = 100 12.5 ma receiver disabled, no receiver load driver enabled, driver load: r l = 100 , 12.5 ma receiver enabled, (r in + = 1v and r in ? = 1.4v) or (r in + = 1.4v and r out ? = 1v) driver disabled, receiver enabled, 7.0 ma (r in + = 1v and r in ? = 1.4v) or (r in + = 1.4v and r in ? = 1v) driver disabled, receiver disabled 7.0 ma c in input capacitance any lvttl or lvds input 4 pf c out output capacitance any lvttl or lvds output 6 pf symbol parameter test conditions min typ max units (note 3) driver timing characteristics t plhd differential propagation delay 0.5 1.5 ns low-to-high t phld differential propagation delay 0.5 1.5 ns high-to-low r l = 100 , c l = 10 pf, t tlhd differential output rise time (20% to 80%) see figure 2 and figure 3 0.4 1.0 ns t thld differential output fall time (80% to 20%) 0.4 1.0 ns t sk(p) pulse skew |t plh - t phl | 0.5 ns t sk(pp) part-to-part skew (note 4) 1.0 ns t zhd differential output enable time from z to high r l = 100 , c l = 10 pf, 5.0 ns t zld differential output enable time from z to low see figure 4 and figure 5 5.0 ns t hzd differential output disable time from high to z 5.0 ns t lzd differential output disable time from low to z 5.0 ns receiver timing characteristics t plh propagation delay low-to-high 0.9 2.5 ns t phl propagation delay high-to-low 0.9 2.5 ns t tlh output rise time (20% to 80%) |v id | = 400 mv, c l = 10 pf, 0.5 ns t thl output fall time (80% to 20%) see figure 6 and figure 7 0.5 ns t sk(p) pulse skew | t plh - t phl | 0.5 ns t sk(pp) part-to-part skew (note 4) 1.0 ns t zh lvttl output enable time from z to high 5.0 ns t zl lvttl output enable time from z to low r l = 500 , c l = 10 pf, 5.0 ns t hz lvttl output disable time from high to z see figure 8 5.0 ns t lz lvttl output disable time from low to z 5.0 ns
www.fairchildsemi.com 4 fin1019 figure 1. differential driver dc test circuit note a: input pulses have frequency = 10 mhz, t r or t f = 2 ns note b: c l includes all probe and fixture capacitances figure 2. differential driver propagation delay and transition time test circuit figure 3. ac waveforms for differential driver note b: input pulses have the frequency = 10 mhz, t r or t f = 2 ns note a: c l includes all probe and fixture capacitances figure 4. differential driver enable and disable test circuit figure 5. enable and disable ac waveforms
5 www.fairchildsemi.com fin1019 note a: input pulses have frequency = 10 mhz, t r or t f = 1ns note b: c l includes all probe and fixture capacitance figure 6. differential receiver voltage definitions and propagation dela y and transition time test circuit table 1. receiver minimum and maximum input threshold test voltages applied voltages (v) resulting differential resulting common mode input voltage (mv) input voltage (v) v ia v ib v id v ic 1.25 1.15 100 1.2 1.15 1.25 ? 100 1.2 2.4 2.3 100 2.35 2.3 2.4 ? 100 2.35 0.1 0 100 0.05 00 . 1 ? 100 0.05 1.5 0.9 600 1.2 0.9 1.5 ? 600 1.2 2.4 1.8 600 2.1 1.8 2.4 ? 600 2.1 0.6 0 600 0.3 00 . 6 ? 600 0.3
www.fairchildsemi.com 6 fin1019 figure 7. lvds input to lvttl output ac waveforms test circuit for lvttl outputs voltage waveforms enable and disable times figure 8. lvttl outputs test circuit and ac waveforms
7 www.fairchildsemi.com fin1019 dc / ac typical performance curves drivers figure 9. output high voltage vs. power supply voltage figure 10. output low voltage vs. power supply voltage figure 11. output short circuit current vs. power supply voltage figure 12. differential output voltage vs. power supply voltage figure 13. differential output voltage vs. load resistor figure 14. offset voltage vs. power supply voltage
www.fairchildsemi.com 8 fin1019 dc / ac typical performance curves (continued) figure 15. power supply current vs. frequency figure 16. power supply current vs. power supply voltage figure 17. power supply current vs. ambient temperature figure 18. differential propagation delay vs. power supply figure 19. differential propagation delay vs. ambient temperature figure 20. differential skew (t plh - t phl ) vs. power supply voltage
9 www.fairchildsemi.com fin1019 dc / ac typical performance curves (continued) figure 21. differential pulse skew (t plh - t phl ) vs. ambient temperature figure 22. transition time vs. power supply voltage figure 23. transition times vs. ambient temperature
www.fairchildsemi.com 10 fin1019 dc / ac typical performance curves receiver figure 24. output high voltage vs. power supply voltage figure 25. output low voltage vs. power supply voltage figure 26. output short circuit current vs. power supply voltage figure 27. power supply current vs. frequency figure 28. power supply current vs. power supply voltage figure 29. power supply current vs. ambient temperature
11 www.fairchildsemi.com fin1019 dc / ac typical performance curves (continued) figure 30. differential propagation delay vs. power supply voltage figure 31. differential propagation delay vs. ambient temperature figure 32. differential skew (t phl - t phl ) vs. power supply voltage figure 33. differential skew (t plh - t phl ) vs. ambient temperature figure 34. differential propagation delay vs. differential input voltage figure 35. differential propagation delay vs. common-mode voltage
www.fairchildsemi.com 12 fin1019 dc / ac typical performance curves (continued) figure 36. transition time vs. power supply voltage figure 37. transition time vs. ambient temperature figure 38. differential propagation delay vs. load figure 39. transition time vs. load
13 www.fairchildsemi.com fin1019 physical dimensions inches (millimeters) unless otherwise noted 14-lead small outline integrated circuit (soic), jedec ms-012, 0.150" narrow package number m14a
www.fairchildsemi.com 14 fin1019 3.3v lvds high speed differential driver/receiver physical dimensions inches (millimeters) unless otherwise noted (continued) 14-lead thin shrink small outline package (tssop), jedec mo-153, 4.4mm wide package number mtc14 fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and fairchild reserves the right at any time without notice to change said circuitry and specifications. life support policy fairchild s products are not authorized for use as critical components in life support devices or systems without the express written approval of the president of fairchild semiconductor corporation. as used herein: 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea- sonably expected to result in a significant injury to the user. 2. a critical component in any component of a life support device or system whose failure to perform can be rea- sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com
www. onsemi.com 1 on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductors product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent ? marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does on semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. typical parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including typic als must be validated for each customer application by customers technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 www.onsemi.com literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your localsales representative ? semiconductor components industries, llc


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